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Part Number: LMZ10500
In a dual sided SMT design, can I solder this device to the 1st side? if so, it'll go thru 2 reflow cycles (last one upside down), and I'm concerned the embedded inductor could fall off. The datasheet doesn't have any warnings against this.
Yes, it can. The device is very light and the area of the pads is sufficiently large. The solder surface tension would be able to hold the device during second reflow. This comment applies to both the module and the inductor on top.
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In reply to Denislav Petkov:
Our CM tried reflowing a similar device upside down, and there were no issues with the chip inductor on top
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