Hi Team,
the datasheet specifies the following thermal resistance.
Can you please specify in more detail in respect to which part of the case (i.e. top or bottom) the parameter is given ?
Do you have thermal heat maps?
- In case it is specified in respect to the case bottom is there any way to calculate Junction-to-case top thermal resistance (e.g. some coefficient that depends on the package).
Do we have thermal coefficients for different packages or app notes that specify thermal coefficients?
Best Regards
Kevin den Toom