HI Team,
My customer considers to use TPS3839G33DQNR.
The datasheet shows "Connect to ground or to a floating copper plane for mechanical stability" for Thermal pad.
What is occured if we connects Thermal pad to VDD?
I believe thermal pad is connected to substrate of the device but my customer thinks it is no ploblem if thermal pad isn't connected to IC internally.
Best Regards,
Yaita / Japan disty