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TPS3839: Thermal pad connection

Guru 29710 points
Part Number: TPS3839

HI Team,

My customer considers to use TPS3839G33DQNR.

The datasheet shows "Connect to ground or to a floating copper plane for mechanical stability" for Thermal pad.
What is occured if we connects Thermal pad to VDD?
I believe thermal pad is connected to substrate of the device but my customer thinks it is no ploblem if thermal pad isn't connected to IC internally.

Best Regards,
Yaita / Japan disty

  • Yaita-san,

    To guarantee stability, the pad must be connected to ground or a copper plate. The thermal pad could be left floating or connected to VDD, but we do not guarantee mechanical stability in this configuration. For more information about the attaching the QFN/SON packages to a PCB, see this app note.

    Regards,

    Ricardo

  • Hi Ricardo-san,

    Thank you for your kind support.

    >The thermal pad could be left floating or connected to VDD, but we do not guarantee mechanical stability in this configuration.
    I understand floating could be mechanical instability, however couldn't understand why connecting to VDD is the same (mechanical instability).

    My customer mistook thermal pad connecting to VDD on current board and wants to know if it affects on their evaluation.
    Could you tell me concern under condition of thermal pad connecting to VDD?

    They will modify the board connecting thermal pad to GND in mass-production board but wants to confirm above at this moment.

    Best Regards,
    Yaita

  • Ricardo-san,

    May I have your comments about the following?
    >Could you tell me concern under condition of thermal pad connecting to VDD?

    Your support would be really appreciated.

    Best Regards,
    Yaita

  • Yaita-san,

    The thermal pad cannot be connected to VDD. The thermal pad is designed to be connected to a floating copper plate or to ground. Without this proper connection the device performance cannot be ensured.

    Thanks,
    Ricardo