TMS320C6748EZWTD4(TI) 在ICT测试出现失效,使用30pcs,不良1pcs。主要不良描述:在产品上的BGA表现为开路,更换BGA恢复正常,测试出是G7 G8对地短路。
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TMS320C6748EZWTD4(TI) 在ICT测试出现失效,使用30pcs,不良1pcs。主要不良描述:在产品上的BGA表现为开路,更换BGA恢复正常,测试出是G7 G8对地短路。
Hi,
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Hi,
Can you please provide some details on what you mean by ICT test.
Is the device soldered on a custom board?
Regards,
Sreenivasa
The components have been soldered on the PCB。TMS320C6748EZWTD4(TI) failed in ICT test, with 30pcs used and 1pcs defective. Main adverse description: BGA on the product is open circuit, replace BGA and return to normal, test is G7, G8 to ground short circuit.4621.The failure information.docx
Hi,
Thank you for the note.
TMS320C6748EZWTD4(TI) failed in ICT test
Can you please explain what do you mean by failed - Pls provide what are you testing and what are you observing on good vs failed board.
If you change the device does the board work - or if you power cycle does the board work or the failed board never works even after replacing the device ?
Regards,
Sreenivasa
Hi Sreenivasa:
Hi
Thank you for the inputs.
CVDD (Core supply) G7, G8, PWR Variable (1.3V - 1.0V) core supply voltage pins
Thee are many more power pins,
E15, G7, G8, G13, H6, H7, H10, H11, H12, H13, J6, J12, K6, K12, L12, M8, M9, N8
Does only G7 and G8 show short. How are you meaning the short?
Are you checking the short before powering the board ?
I have limited visibility of the board and can provide guidance to debug.
I assume you have reviewed and following the below sequence
6.3.1 Power-On Sequence, 6.3.2 Power-Off Sequence
You lists the power sequencing in the word document. Have you had a chance to compare the waveform difference between the good and the bad.
On the Bad board, once the device is placed dos the new device continue to work without failure.
One of the approach for debug is A-B swap meaning if you put the failed device on another working board - does the board show failure ?
Regards,
Sreenivasa
Hi Sreenivasa:
Does only G7 and G8 show short. How are you meaning the short?
1. The test found that only G7 and G8 had short circuits.
Are you checking the short before powering the board ?
2. ICT tested.
You lists the power sequencing in the word document. Have you had a chance to compare the waveform difference between the good and the bad.
3, remove the chip board has been scrapped!
4.Please help to arrange the analysis of the defective samples as soon as possible, thank you
Hi
Thank you for the inputs. I am checking internally on the next steps.
Are you open to sharing design information if required for review.
Regards,
Sreenivasa
Hi
Thank you for the note.
I am internally checking on the process.
Can you help me understand if you have been working with any of the TI sales teams.
Regards,
Sreenivasa
Hi
Thank you for the name. I will check internally and update.
Regards,
Sreenivasa
Hi
Thank you for checking.
I have reached out to Nicole Dai. I would suggest you to also reach out to Nicole Dai for the next steps.
I will update you when i hear from Nicole Dai.
Regards,
Sreenivasa