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TDA4VH-Q1: Question about power and oculink

cao qi
Intellectual 786 points

Part Number: TDA4VH-Q1
Other Parts Discussed in Thread: CSD18543Q3A, CSD18563Q5A, LM5143

51 Reference design power MOSFET selection: 1, whether CSD18563Q5A has a vehicle model, the same question CSD18543Q3A 2, if not, the same package (the same application environment), TI has no alternative recommendation
52 Reference circuit LM5143 two power supplies: VOUT1/VOUT2 output current detection, without requiring high accuracy, can the sense resistor R165 be removed, directly sampling at both ends of the power inductor L22, what are the disadvantages?
What does the cross-resistance R150 and R151 on the differential sampling path do, and can they be removed? See screenshot
53 Reference Design: Is SoC Supply Noise Speaking purely for the convenience of testing power supply ripple close to the load pins? Another test method tests the ripple across the capacitance on the back of the load pins. What is the difference between the two methods
See screenshot
54 The JTAG schematic uses 60PIN, can I directly use a connector with only JTAG debug signals?
55 OCULINK interface definitions need to be given a copy
56 Reference Design Multiphase Power Far/Near Feedback: PCB Reference Design Selects Remote Feedback, Sampling Selects One, R208&R203 Combination or R205&R201 - What is the role of series resistance, the role of resistance is only network transformation?
The GOSNS of frequency compensation COMP takes the remote feedback ground, that is, the SOC PWR is close to GND - what is the purpose?
57 Reference Design Power Supply LM5143: Series Resistors on the Differential Sampling Path, What Does It Do?
58 Reference Design Power Supply LM5143: What is the purpose of introducing current sensing separately in parallel branches, and reintroducing current sensing after merging?

  • 0
    TI__Expert 7655 points

    SoC & EVM Item replies below. All LM5143 items will be address by LM5143 Apps Engr.

    Item 53:  EVM test boards use Kelvin Sensing (KS) for a few reasons:
       1. Provide easy access to key power rails at the point of load underneath the SOC so that differential scope probes to make more reliably measurements across different boards/UUTs.
       2. KS measurements improve accuracy by measuring closer to/at SoC power ball/via while measuring across a decoupling cap may have a small trace Z that is not accounted for
       3. KS removes any impact of high current temperature rise of the conducting power path

    Item 54: 60-pin connector enables trace data to be transferred to emulator/debugger interface for more insight. Standard JTAG connector can be used but without trace debugging information.

    Item 56; EVM design provisioned alternative remote sensing to evaluate potential to improve/optimize high-current buck transient response. TI still recommends remote sensing as close to point of load as possible.

  • 0 in reply to Bill McCracken
    TI__Guru 69081 points

    57 : I cannot see the schematic clearly.  If you are talking about the resistors connecting the current sense resistor and the VOUT-CS pins, they are part of differential mode RC filter. 

    58 : I cannot see the schematic clearly...again. I guess you are asking the reason why the device needs two current sense resistors. The LM5143 device is a dual-channel device employees 'peak current mode' and the device can be configured as a single-output dual-phase buck converter. In this configuration,  each channel needs single-phase inductor current information to modulate pulse-width.