AM625: ALW package pad diameter

Koichiro Tashiro

Part Number: AM625

Hi,

My customer wants to know Pad diameter of BGA package (ALW).
Please see below diagram.

Could you provide this information?

Thanks and regards,
Koichiro Tashiro

over 1 year ago

0 Kallikuppa Sreenivasa over 1 year ago

TI__Guru**** 168084 points

Hello Koichiro Tashiro,

Thank you for the query.

Help me understand the use case for the ball diameter.

I need to check internally.

Regards,

Sreenivasa

0 Kallikuppa Sreenivasa over 1 year ago in reply to Kallikuppa Sreenivasa

TI__Guru**** 168084 points

Hello Koichiro Tashiro,

Refer below inputs i received.

The ball diameter is 0.3mm

Regards,

Sreenivasa

0 Koichiro Tashiro over 1 year ago in reply to Kallikuppa Sreenivasa

TI__Mastermind 22340 points

Hi Sreenivasa,

Thanks for your reply.

Kallikuppa Sreenivasa said:
The ball diameter is 0.3mm

I think 0.3mm is the ball diameter. I thought it is written in datasheet.
What my customer is asking is "pad diameter on IC side".

Thanks and regards,
Koichiro Tashiro

0 Kallikuppa Sreenivasa over 1 year ago in reply to Koichiro Tashiro

TI__Guru**** 168084 points

Hello Koichiro Tashiro,

Thank you for the note and understand.

Let me check and update you.

Regards,

Sreenivasa

+1 Kallikuppa Sreenivasa over 1 year ago in reply to Kallikuppa Sreenivasa

TI__Guru**** 168084 points

Hello Koichiro Tashiro,

Looks like i did not add all the information in the previous message leading to confusion.

Please refer below:

Confirmed that our pkg solder ball pad (substrate pad) is 0.25mm

The recommendation is 1:1 ratio between PCB pad and substrate pad.

The ball diameter is 0.3mm

Please let me know if this helps.

Regards,

Sreenivasa

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AM625: ALW package pad diameter