AM625SIP: Does AM62x series need heat sink?

Genius 3186 points

Part Number: AM625SIP
Other Parts Discussed in Thread: SK-AM62-SIP,

May I have question about AM62x series's heat?

My custmer is wondering does need heat sink for mass production.

Qustion 1 :

I think basecally does not need heat sink if using AM62x series EVM.

But chip was Hot when need high performance of processing

Is there any information that conditions of need heat sink if using SK-AM62A, SK-AM62-SIP?

Question 2 :

In custome board, Is the AM62Ax, AM625SIP recommanded add heat sink and fan?

Thanks,

over 1 year ago

0 Kallikuppa Sreenivasa over 1 year ago

TI__Guru**** 192009 points

Hello GR,

Thank you.

Please check if the below FAQ helps.

https://e2e.ti.com/support/processors-group/processors---internal/f/processors---internal-forum/1302507/faq-am623-package-alw-contact-pressure-specification-for-thermopad

Regards,

Sreenivasa

0 GR over 1 year ago in reply to Kallikuppa Sreenivasa

Genius 3186 points

Hello Sreenivasa,

Thanks for your supporting.

I can not open your URL.

Is there publicly available information?

Best ragards,

0 Kallikuppa Sreenivasa over 1 year ago in reply to GR

TI__Guru**** 192009 points

Hello GR,

Thank you.

Please refer below:

In customer's current AM6232 design they have to use a heat sink on top of MPU.

A “ThermoPad” is then used between the heat sink and AM6232.

In order for this to work correctly, a certain amount of contact pressure is required.

I don't think there will be any serious pressure damage at this point, but the manufacturer of the ThermoPad asks about permissible pressure loads for the ALW housing.

Can you give me some information about this?

Thanks, Dirk

Hello Dirk

Please refer below inputs received.

This is a FCCSP with package designator ALW0425A.

425 solder balls with 0.3mm diameter. Each solder ball can take up to 0.78N. So for this package, it can withstand up to 331N
with pressure apply on the top.

If customer want to apply a heatsink on top of the package, the pressure apply on the top should not exceed 331N.

Besides, this kind of package doesn’t has a thermal pad or heatsink on the package top. Adding a heatsink on
top of the mold compound will improve thermal dissipation no more than 10%. Not very efficient.

Regards,

Sreenivasa

0 GR over 1 year ago in reply to Kallikuppa Sreenivasa

Genius 3186 points

Hello Sreenivasa,

Thanks for your supporting.

I think this is mechnical information of push stress of heat sink.

I want to know AM62A, AM625SIP need or not need heat sink.

If need, Is there any information of environmental conditions?

Best regards,

+1 Kallikuppa Sreenivasa over 1 year ago in reply to GR

TI__Guru**** 192009 points

Hello GR,

Thank you.

For some reason the second part of the answer is not visible. Please refer below

This is a FCCSP with package designator ALW0425A.

425 solder balls with 0.3mm diameter. Each solder ball can take up to 0.78N. So for this package, it can withstand up to 331N
with pressure apply on the top.

If customer want to apply a heatsink on top of the package, the pressure apply on the top should not exceed 331N.

Besides, this kind of package doesn’t has a thermal pad or heatsink on the package top. Adding a heatsink on
top of the mold compound will improve thermal dissipation no more than 10%. Not very efficient.

Regards,

Sreenivasa

0 GR over 1 year ago in reply to Kallikuppa Sreenivasa

Genius 3186 points

Hello Sreenivasa,

Thanks for your information.

Kallikuppa Sreenivasa said:
Besides, this kind of package doesn’t has a thermal pad or heatsink on the package top. Adding a heatsink on
top of the mold compound will improve thermal dissipation no more than 10%. Not very efficient.

Is this mean Heat sinks are not effective and TI think they are not needed, If mold compound package as AM62x, AM625SIP?

And How was AM62Ax? TI suggest use heat sink?

I think AM62Ax's top is metal looks like AM64x.

Best regards,

+1 Kallikuppa Sreenivasa over 1 year ago in reply to GR

TI__Guru**** 192009 points

Hello GR,

Thank you.

GR said:
Is this mean Heat sinks are not effective and TI think they are not needed, If mold compound package as AM62x, AM625SIP?

Customers will have to perform thermal simulations for specific case. this is the general case. We have not provided provision for heat-sink on the EVM.

GR said:
And How was AM62Ax? TI suggest use heat sink?

I think AM62Ax's top is metal looks like AM64x.

We do not have heat sink provision on the EVM. Customers should perform thermal simulation to their specific use case.

Regards,

Sreenivasa

0 GR over 1 year ago in reply to Kallikuppa Sreenivasa

Genius 3186 points

Hello Sreenivasa,

Thanks for your information.

I understand it.

When Is the AM625SIP thermal model released?

Best regards,

0 Kallikuppa Sreenivasa over 1 year ago in reply to GR

TI__Guru**** 192009 points

Hello GR,

Thank you.

The team is working internally. I will have to check on the plan.

is this for a customer use case?

Regards,

Sreenivasa

0 GR over 1 year ago in reply to Kallikuppa Sreenivasa

Genius 3186 points

Hello Sreenivasa,

Thanks for checking.

Kallikuppa Sreenivasa said:
is this for a customer use case?

Yes, my customer is interested in AM625SIP.

They are currently evaluating the AM625x based on element(software) development in one oppotunity,

but there is a possibility that we will choose the AM625SIP for prototyping.

Best regards,

0 Kallikuppa Sreenivasa over 1 year ago in reply to GR

TI__Guru**** 192009 points

Hello GR,

Thank you.

Let me check with the team internally.

Please expect some delay.

Regards,

Sreenivasa

+1 Kallikuppa Sreenivasa over 1 year ago in reply to Kallikuppa Sreenivasa

TI__Guru**** 192009 points

hello GR,

GR said:
is this for a customer use case?

Yes, my customer is interested in AM625SIP.

They are currently evaluating the AM625x based on element(software) development in one oppotunity,

but there is a possibility that we will choose the AM625SIP for prototyping.

Based on the inputs i received currently we do not have a model to share.

The simulation team is working on this. We currently do not have an estimate for the timeline since this includes integration of the SoC and the memory.

Regards,

Sreenivasa

0 GR over 1 year ago in reply to Kallikuppa Sreenivasa

Genius 3186 points

Hi Sreenivasa,

Thanks for your information.

I understand it.

If TI does not provide AM625SIP model, I think we could use AM6254 and LPDDR4 thermal model.

Is there production that specific is similer to AM625SIP's LPDDR4?

Best regards,

+1 Kallikuppa Sreenivasa over 1 year ago in reply to GR

TI__Guru**** 192009 points

Hello GR,

Thank you.

GR said:
Is there production that specific is similer to AM625SIP's LPDDR4?

Could you please elaborate.

For the LPDDR4 information Pls refer below

https://www.ti.com/lit/ds/symlink/am625sip.pdf

6.3 Recommended Operating Conditions

Regards,

Sreenivasa

0 GR over 1 year ago in reply to Kallikuppa Sreenivasa

Genius 3186 points

Hi Sreenivasa,

Kallikuppa Sreenivasa said:
GR said:
Is there production that specific is similer to AM625SIP's LPDDR4?

Could you please elaborate.

If you have an existing product that is similar in characteristics to LPDDR4 in the AM625SIP, I can use this product(ISSI LPDDR4) and the AM6254 thermal model.
I think we can predict the heat of the AM625SIP to some extent.
(I'm not familiar with thermal simulation, so it's as nuanced as you can get.)

Kallikuppa Sreenivasa said:
For the LPDDR4 information Pls refer below

https://www.ti.com/lit/ds/symlink/am625sip.pdf

6.3 Recommended Operating Conditions

I will refer to ISSI IS43/46LQ16256B.

Thanks for your information.

Best regards,

+1 Kallikuppa Sreenivasa over 1 year ago in reply to GR

TI__Guru**** 192009 points

Hello GR,

Thank you for the note and understand.

Regards,

Sreenivasa

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AM625SIP: Does AM62x series need heat sink?