Good day,
I would like to find out what would make the top late to dislodge in the device and the marking to be removed all together.
TMS320C6454BGTZA
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Good day,
I would like to find out what would make the top late to dislodge in the device and the marking to be removed all together.
TMS320C6454BGTZA
Can you elaborate on your question.
I would like to find out what would make the top late to dislodge in the device
What do you mean by top (p)late dislodge?
and the marking to be removed all together
Do you mean all the symbolization has gone?
What are the circumstances? New parts? Mounted? Time in service? Environment?
--Paul
Thanks, so, just to be sure I understand, no damage to the device, just loss of symbolization.
Did this happen to only one device or several out of how many?
From where were they purchased?
Do you have any pictures of the symbolization pre-wash?
--Paul
Do you have any pictures of the symbolization pre-wash?
Heatsink? Is the just referring to the top of the package, not an actual heatsink?
Did this just happen to a single device, multiple, or all? How many total?
--Paul
Herewith the pictures of the device, the heat slug came off, the affected were 5, however only the x4 came off. If you have to recommend the glue, which one would we use?
Yes, as is it does not look dammed, We sent one for the PCB-A functional testing. Will advice with the results soon.
That's for the additional information. I am checking internally.
How many total boards went through the process?
Please do update with the results of the functional testing.
Paul
For now, please only test the the board/part with the heat slug still attached.
Karabo
Can you provide copies of documentation on the purchase history of the parts and pictures of any labels on the ESD packaging?
--Paul