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Tool/software:
Hi Team,
We are planning to benchmark SK-AM64B schematic design and board file for our new gateway design. We are using most of the interfaces in SOC AM6442. In starter kit there is no heat sink / fan we found, But in EVM it is present. Is it really required? Can you please share the part number of the heat sink used in evm. also want to know any active cooling is required? like fan.
Hello Jitesh Balan,
Thank you for the query.
We are using most of the interfaces in SOC AM6442. In starter kit there is no heat sink / fan we found, But in EVM it is present.
Please point me to the EVM document that mentions the hear sink that you quoted above.
Regards,
Sreenivasa
Sreenivasa - I think you and I covered the heat sink topic already - ref SK-AM64B: SK-AM64B - Processors forum - Processors - TI E2E support forums
regards, Jim
Hello Jim,
Thank you.
Can you verify the thread you linked. Did you intend to link a different link.
Regards,
Sreenivasa
Hello Jim,
Thank you.
I did ask for some additional inputs in the other thread.
I suspect the marking for the socket of the EVM seems to be taken as heat sink provision.
Jitesh, Could you confirm.
Regards,
Sreenivasa
Hi Team,
Thank you for the response, We are provided the heat sink option as same as in TMDS64EVM layout, please share the part number of same heatsink if available. i am not able to see the part number in evm BOM.
Hello Jitesh,
Thank you.
Please point me to the reference designator that you believe is heat sin.
We do not have heat sink on the EVM or a part number that has been tested to share.
Regards,
Sreenivasa
Sreenivasa, Jitesh:
for what it is worth, I have been using this heatsink affixed to the AM6442 on my SK-AM64B : Ohmite p/n bgah170-075e . This is not necessarily the heatsink I will go to production with, but as an fyi
Jim
Hello Jim,
Thank you.
Could you provide your thoughts on the use case for the heat sink and id this has provided performance benefits that you could notice.
Regards,
Sreenivasa
We only used this heatsink onto the SK-AM64B's AM6442 just to have some dissipation when testing (have not taken any temperature readings on this). Again, the means to "heatsink" the AM6442 on the SOM that we are using has not been aligned with mechanical engineering team. The AM6442 has not been put through rigorous testing to date.
Hello Jim,
Thank you.
Let me check with the device expert to get his thoughts on the need for hear sink.
Regards,
Sreenivasa
Sreenivasa:
I thought the need for a heatsink is design dependent - please recall this e2e post from 3 years ago:
(this heatsink topic should generate an FAQ in my humble opinion)
(+) AM6412: heat sink stick/screw mounted? - Processors forum - Processors - TI E2E support forums
Hello Jim,
Thank you for the inputs and agree with your thoughts on the hear sink.
Please refer below inputs i received from the expert
A heatsink may be required on a small PCB assembly. The customer needs to perform thermal analysis with their actual PCB design using the worst case power consumption expected for their application in the worst case environment to know if a heatsink is required. Another choice would be to measure the device case temperature while operating in the worst case operating condition and calculating the junction temp based on the measured case temperature. They could also use the on-die temp sensor to measure the junction temperature while operating in the worst case operating condition and makes sure they are within the accuracy of the temp sensor below the allowed junction temperature.
Regards,
Sreenivasa
Sreenivasa: suggest TI get an [FAQ] generated on the AM64x heatsinking topic.
Jim