AM625SIP: Need for heatsink?

Antenna_Head

Part Number: AM625SIP

Tool/software:

I've searched E2E and bit and haven't found a good answer on this topic yet.

Can you please point me to some resources on how to estimate whether or not a heatsink would be required to use AM625SIP?

It seems it would depend on how many cores were used and the utilization, with the worst case being all cores running 100%. That seems pretty unlikely scenario, though.

How can we estimate how hot the die will get and if a heatsink would be required?

thanks, -Steve

4 months ago

0 Kallikuppa Sreenivasa 4 months ago

TI__Guru**** 191289 points

Hello Steve,

Thank you for the query.

Can you please confirm the query is for the AM625SIP.

We recommend customer to perform thermal simulations based on their use case.

Based on the confirmation i will have to check internally since i do not see the model on TI.com.

Regards,

Sreenivasa

0 Antenna_Head 4 months ago in reply to Kallikuppa Sreenivasa

TI__Genius 12740 points

They are considering the device for a new design- the don't know the power consumption yet so are looking for guidance from the TI team. There are thermal parameters in the datasheet, but of course without knowing power dissipation, these aren't very helpful either.

They're looking for general guidance/statistics on how often customers need heat sinks, etc...

Any thoughts you could provide may be helpful.

Thanks, -Steve

0 Kallikuppa Sreenivasa 4 months ago in reply to Antenna_Head

TI__Guru**** 191289 points

Hello Steve,

Thank you.

The below FAQ may be of help

https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1332295/faq-am623-package-alw-contact-pressure-specification-for-thermopad

The package does not have a thermal pad or heatsink on the package top.

I checked with the team on the availability of thermal model. We currently do not have compact thermal model.

I understand there is a detailed thermal model shared under NDA.

Can you please confirm customer has an NDA.

Regards,

Sreenivasa

0 Antenna_Head 4 months ago in reply to Kallikuppa Sreenivasa

TI__Genius 12740 points

This is for Tigo Energy. Yes, we have an NDA. Thanks!

0 Kallikuppa Sreenivasa 4 months ago in reply to Antenna_Head

TI__Guru**** 191289 points

Hello Steve,

Thank you.

The simulation expert is out of office till early next week.

I will follow-up and update you.

Regards,

Sreenivasa

0 Antenna_Head 4 months ago in reply to Kallikuppa Sreenivasa

TI__Genius 12740 points

Please let me know when you think we'll have an answer here- would like to keep the customer informed. Thanks!

0 Kallikuppa Sreenivasa 4 months ago in reply to Antenna_Head

TI__Guru**** 191289 points

Hello Steve,

Thank you.

I will follow-up and try to provide the model this week.

Regards,

Sreenivasa

0 Kallikuppa Sreenivasa 4 months ago in reply to Kallikuppa Sreenivasa

TI__Guru**** 191289 points

Hello Steve,

Update on the model:

I received the ALW package model but not sure if this is the one for the AM625SIP AMK package.

I am checking internally.

Regards,

Sreenivasa

0 Kallikuppa Sreenivasa 4 months ago in reply to Kallikuppa Sreenivasa

TI__Guru**** 191289 points

Hello Steve,

Since the model is expected to be shared under NDA, help me understand how you would want me to share the model when available.

Regards,

Sreenivasa

0 Antenna_Head 4 months ago in reply to Kallikuppa Sreenivasa

TI__Genius 12740 points

Thanks; I'll get back to you with details once we confirm with the customer. I'm not sure what tools, etc... they have.

0 Kallikuppa Sreenivasa 4 months ago in reply to Antenna_Head

TI__Guru**** 191289 points

Hello Steve,

Thank you.

Regards,

Sreenivasa

Processors

Processors forum

AM625SIP: Need for heatsink?