TDA4VEN-Q1: Land pad size on the package side

KIM JIWON

Prodigy 60 points

Part Number: TDA4VEN-Q1

Tool/software:

Hi, TI

Could you please tell me the land pad diameter on the package side?

I cannot figure out from 3D model, also datasheet.

3 months ago

0 kcastille 3 months ago

TI__Guru 54422 points

Hi Kim,

We are following up with our packaging team. Can you summarize the background for your question?

Thanks,

Kyle

0 Robert Eschler 3 months ago in reply to kcastille

TI__Guru 52285 points

It is normally recommended to have the PCB pad size and the package pad size the same. This creates the strongest solder joint. That is typically where the PCB pad recommendation in data sheet is derived.

+1 KIM JIWON 3 months ago in reply to Robert Eschler

Prodigy 60 points

So, do you mean the land size of package is Φ0.35？

+1 Robert Eschler 3 months ago in reply to KIM JIWON

TI__Guru 52285 points

Correct. I'm trying to confirm for this specific package - but resources are currently out of office. I will follow-up if I get additional clarification.

0 KIM JIWON 3 months ago in reply to Robert Eschler

Prodigy 60 points

Thank you for your response.

The problem has been resolved, but it would be great if you could also share any relevant documents.

+1 Robert Eschler 3 months ago in reply to KIM JIWON

TI__Guru 52285 points

I've confirmed the information for TDA4VEN-Q1. The pad size is actually 0.45, but the solder mask opening is 0.35 (SMD or solder mask defined). For the solder ball shape to be same top/bottom - the pad size on the PCB is recommended to be 0.35 (assuming NSMD)

0 KIM JIWON 3 months ago in reply to Robert Eschler

Prodigy 60 points

Thank you for checking it promptly.

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TDA4VEN-Q1: Land pad size on the package side