Hello,
I am interested in understanding how much force can be applied to the top of the AM5K2E04 package before damage would occur during normal operation within the suggested operating range.
The goal here is to see how much compression from a gap pad and associated thermal plate that can safley be asserted to maximize thermal transfer away from the ARM package. We are thinking of nomially applying 3.6lbs of pressure to achieve our goal, but have no idea idea if this is an acceptable mechanical tolerance for the chip package and associated solder balls.
Thank you,
Mark
