AM5728: 3D package model

Dear All,

I am doing an industrial board with AM5728 which includes DAC8775,  ADC components DI and DO, I am following this schematic (www.ti.com/.../tidrlh4.pdf).  Today I completed the PCB package for AM5728.

1-)The picture on the Mechanical data shows a mirrored image of the bottom view ( I believe ) so I made the PCB package mirrored from this mechanical data. I want to clarify the pins, starting points, rotation etc with the 3D image. I removed the unused pins from the package for better fan out.

2-) For 0.8mm pitch BGA package I have used 0.45 mm ball size (on the previous designs) but on the Gerber file of IDK(AM572x Industrial Development Kit) I found 0.4 mm ball dimension so I am a little bit confused shell I continue using 0.45  as usual instead of 0.4 mm which IDK has? or is there a particular reason that IT design uses 0.4mm ball on the PCB?

This is TI's Gerber files dimension (which I have used on AM5728 PCB package

This picture on the bottom is my previous 0,8mm BGA package which is 0,05mm wider than TI's (0.45mm ball size)

3-) I am planning to remove reserved pins  Y5 / Y10 / K14 / B28 /A27 from the PCB package as well since I can use some more routing space under the BGA. I wonder if this creates such a problem for the flying balls under the package(if they can stick to some other balls which are close). Please let me know if I am overthinking. 

4-) Can you please double check if my design is a mirrored, or a correct layout.


To sum up, I am doing all the design from your documentation but I want to clarify stuff with your expertise.

Best Regards.

Dear Tom,

Thank you for your time, 

Referring to the 1st question:

*1-)  "I removed the unused pins from the package for better fan out."

-if you check AM572x Sitara™ Processors Silicon Revision 2.0 page 9, there is an explanation for unused pads,  and it says that: 

The following bottom balls are not connected: AF7 / AF10 / AF13 / AF16 / AF19 / AE4 /
AE25 / AB26 / W3 / W26 / T3 / T26 / N3 / N26 / K3 / K26 / G3 / D4 / D25 / C10 / C13 / C16 /
C19 / C22.
These balls do not exist on the package.

so it makes sense to me to remove these pads on the footprint, as you can see from my footprint file they are not there(check the picture)... 

Referring to the 3th question:

*3-) I am planning to remove reserved pins  Y5 / Y10 / K14 / B28 /A27 from the PCB package as well. 
With unused pins, I never think about removing their pads. I suppose your answer should be for reserved pins instead of unused pins? if your answer is for Unused pads let me know I will correct myself. I am confused since you write "unused". Since these balls do not exist on the package as silicon revision 2.0 it makes full sense to me to remove them. But reserved pins have the balls, so I shouldn't remove them.

if you can provide links for this I will appreciate: 
"There are ball diagrams in other parts of the document to help guarantee that you get this right.  Also, there is an Altium symbol that can be downloaded to help with this."

I will appreciate if you supply Altium symbol as well, wherever I check I can't find them. I have found Orcad CAD files instead of Altium.

Thank you.

Dear All, 

Can you send me .ALG file from the .BRD file. 

I can start from that file for the conversions. 

Best Regards.