I am working on a design where I would like to use the TCI6638K2K Multicore DSP+ARM® KeyStone™ II System-on-Chip (SoC). During my research, I discovered that could not find an official mechanical package drawing of the AAW package. This is the page where I would have expected it to be: ["http://www.ti.com/packaging/docs/searchtipackages.tsp?packageName=BGA"]
Can anyone point me in the right direction?