In the data sheet it says on sheet 62 of 63, THERMAL PAD, SIZE AND SHAPE SHOWN ON SEPARATE DRAWING.
What is the dimension of the pad and what is the recommended layout to support this chip?
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In the data sheet it says on sheet 62 of 63, THERMAL PAD, SIZE AND SHAPE SHOWN ON SEPARATE DRAWING.
What is the dimension of the pad and what is the recommended layout to support this chip?
While there is a layout shown in both documents, there are no dimensions. The Gerber Files would have been more useful or a recommended layout.
The board files can be found here: LMX8410LEVM.zip
The EVM for final release will be slightly different, mainly some RF/LO/IF trace impedance tuning. But in terms of thermal pad design and package dimensions, there is no difference.
Regards,
Hao