I am new process development engineer responsible for adhesive processing. We produce loudspeakers for the automotive industry.
We are interested to learn about the TI DLP technology. Our Application would firstly be to calculate the volume of a dispensed glue-bead right after application onto a surface. Scanning of the bead (mostly circular glue beads, with a diameter varying between 10 and 200mm) and calculation would need to be done within our line cycle time, at 3 to 3.5 seconds.
Please tell me how your product can be best demonstrated, how implementation would be supported etcetera. Looking forward to hear more!