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Hi there,
I'm dave hardware engineer
I designed using iwr6843aop. after that, I will make pcb.
So, I found stack-up
reference : https://www.ti.com/lit/an/swra672/swra672.pdf
But It's hard to get inner layer 61um, prepreg 94um materials.
So PCB company proposed me to changed as below.
Can you let me know it's possible or not? and give me some advice about that.
thank you.
Hello Dave,
Since it seems only the ground layers have changed significantly, this might be ok. However please give me until Thursday for a closer review.
Regards,
Jackson
Thomas, Thank you for reply.
so, is there anything to know to pcb manufacturing company?
If not, I will make it according to the above.
and second question, Can i use copper foil 1oz? what do you recommend?
Regards,
Dave.
Hi Dave,
The thicker ground layers will help to improve the thermal performance of the board. The 1oz layers you have will be ok, you just need to manage the thermal tradeoffs.