LM75A: Ball composition

Kota Morihara

Intellectual 630 points

Part Number: LM75A

Customers have asked the following questions to register their products. Can you give me more details?

Material:LM75AIMME/NOPB

1. Use Ni for grounding or not. : Yes / No

2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

Your prompt support would be highly appreciated, thank you!

11 months ago

0 Alex Thompson 11 months ago

TI__Expert 5670 points

Hello,

I don't have the answers for your immediately, so I have reached out to our team's packaging engineer to get these answers for you. I will reply back on this thread within 24 hours with their response. Thank you for your patience.

-Alex Thompson

0 Alex Thompson 11 months ago in reply to Alex Thompson

TI__Expert 5670 points

Hello,

I still haven't recieved a response from our packaging engineer, this is a very old device so it may take some time to get this information. I will respond again within 24 hours with an update. Could you please provide some context as to why this information is needed?

Thank you for your patience.

-Alex

+1 Alex Thompson 11 months ago in reply to Alex Thompson

TI__Expert 5670 points

Hello,

I have the response from our packaging team:

1) Use Ni for grounding or not. : Yes / No

Yes, thin Ni will be involved in any electrical path through the leads.

2) Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

All the Ni + Pd + Au is much less than 10 um for standard plating

Regards

-Alex Thompson

Sensors

Sensors forum

LM75A: Ball composition