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LM75A: Ball composition

Kota Morihara
Intellectual 630 points
Part Number: LM75A

Customers have asked the following questions to register their products. Can you give me more details?

Material:LM75AIMME/NOPB

1. Use Ni for grounding or not. : Yes / No

2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

Your prompt support would be highly appreciated, thank you!

  • 0
    TI__Expert 5670 points

    Hello,

    I don't have the answers for your immediately, so I have reached out to our team's packaging engineer to get these answers for you. I will reply back on this thread within 24 hours with their response. Thank you for your patience.

    -Alex Thompson

  • 0 in reply to Alex Thompson
    TI__Expert 5670 points

    Hello,

    I still haven't recieved a response from our packaging engineer, this is a very old device so it may take some time to get this information. I will respond again within 24 hours with an update. Could you please provide some context as to why this information is needed? 

    Thank you for your patience.

    -Alex

  • +1 in reply to Alex Thompson
    TI__Expert 5670 points

    Hello,

    I have the response from our packaging team:

    1) Use Ni for grounding or not. : Yes / No

    Yes, thin Ni will be involved in any electrical path through the leads. 

    2) Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

    All the Ni + Pd + Au is much less than 10 um for standard plating

    Regards

    -Alex Thompson