TMAG5111: distance form top to die

Hi Tatsuki-san,

Unfortunately we do not specify min or max values for the distance from the top of the package to the die. We only specify typical values, which in this case is 0.741 mm from the top of the package to the die.

Theoretically, based on the package dimensions shown, the maximum distance from the top of the package to the die would be 1.1 mm if we assume a die location of the bottom of the mold compound, but again this maximum distance is not specified.

Best regards,

Jesse