Other Parts Discussed in Thread: TMP117,
Hi Team,
My customer is looking at the TMP116 & the TMP117, and is also looling at the following application report,
- Precise Temperature Measurements With the TMP116 and TMP117
In the above application report, from page 10 to 11, there are the following descriptions,
The reasonable question is: when the thermal pad is not soldered, by how much will the thermal resistance between the sensor and the PCB going to increase? In conducted experiments, the device was soldered to a rigid coupon board 11-mm × 22-mm × 1.1-mm size with no vias under the part and a copper radiator was attached to the opposite side of PCB. (The silicon thermo conductive paste between copper radiator and PCB back side was applied). The measurements showed that not soldering the package thermo pad increased the thermal resistance from 75 to 140ºC/Wt . By knowing the thermal resistance and device thermal mass Mt = 5.1 mJ/ºC, it is possible to calculate the sensor thermal response time with Equation 4.
The calculated response time values are 0.39 and 0.72 seconds and measured response time matched the calculated values. Because the device package thermal mass is extremely small, the thermal response time is also very small and even the 0.72 second value, when the thermal pad is not soldered, satisfies most users applications.
The customer wants to know the measured thermal response time and test condition.
Could you show me those information?
Thank you.
Best Regards,
Koshi Ninomiya
