I would like to use tmp102-q1 in my LED flash light application. I am planning to place the sensors on the same side of the LEDs and as close as possible to LEDs. As per SBOS702B page 22 (layout guidelines) a 'Ground Plane is used for Thermal Coupling to Heat Source'.
Do I have to open the solder mask under the IC to ensure max. heat exchange between GND plane and IC?