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TS5A22366: DSBGA bottom-side insulation from solder balls

Eric S
Expert 5560 points
Part Number: TS5A22366

We are looking at the bottomside of TI BGA part TS5A22366 image. Seems like it is just a bare silicon. We are wondering if there is any insulation layer, to protect the silicon from shorting to the solder ball, during reflow.  I'm sure there must be, but could you please comment on any such insulation and/or risk to active circuitry during reflow?

  • +1
    TI__Genius 10974 points

    Hi Eric,

    There are several layers (including insulating dielectric and passivation layers) between the solder balls themselves and the actual silicon substrate. Thus, this will prevent any reflow issues to any active circuitry as the solder balls themselves cannot effectively be exposed to those conductors unless these layers are physically removed from the die.

    Thanks!

    Bryan