SN74CB3Q3257: Coefficient of Thermal Expansion (CTE) for Part Number SN74CB3Q3257RGYR

David Weisenberg

Part Number: SN74CB3Q3257

I am working on a solder joint fatigue analysis for a board that uses a lot of TI parts. Can you please tell me the coefficient of thermal expansion (CTE) of part number SN74CB3Q3257RGYR ?

Thanks in advance for your help!

over 4 years ago

0 Saminah C over 4 years ago

TI__Genius 9132 points

Hi David,

The SN74CB3Q3257RGYR has Cu as base metal and pre-plated NiPdAu coating. The CTE are about 17 and 13 ppm/⁰C respectively for these two materials.

Regards,

Saminah

0 David Weisenberg over 4 years ago in reply to Saminah C

Intellectual 510 points

Thank you for the assistance!

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SN74CB3Q3257: Coefficient of Thermal Expansion (CTE) for Part Number SN74CB3Q3257RGYR