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Tool/software: TI C/C++ Compiler
The firmware for our BLE product supports OAD with equal A and B images, and so is seriously CODE space constrained when linking. In order to update our firmware project from the TI BLE 1.4.0 stack to the 1.4.2.2 stack, we needed to remove as much unused code as possible. Our product does not support pairing or bonding (and should in fact reject all pairing and bonding requests), so we figured we could remove the GAP Bond Manager code from our project.
We did so by excluding gapbondmgr.c (and .h) from our builds, removed the GapBondMgr initialization in our osalInitTasks function, removed the GapBondMgr_Register call from our main application, and removed calls in peripheral.c on LINK_ESTABLISHED and LINK_TERMINATED.So far this is working ok, although we are early in the testing process. Can anybody think of any problems that we’ll encounter by removing the Bond Manager? Are there other places in SimpleBLEPeripheral-derived projects that rely on the GapBondMgr? And can anybody think of any other code or modules that can be removed if our device does not support pairing and bonding (such as the Security Manager)?Thanks in advance for any help …
