CC2652R: Die attach void criteria

Dorian Vazquez

Part Number: CC2652R

Hello,

I wanted to know the criteria of die attach voids for part number CC2652R1FRGZR.

Is there any allowed size or percentage for the voids?

Are there any functional or thermal issues with the presence of the voids?

Thanks

0 FI over 1 year ago

Hi,

I believe this X-ray is that of the device already on the PCB. The pad is missing vias.

See the following for general guidance. https://www.ti.com/lit/pdf/slua271

regards

0 Dorian Vazquez over 1 year ago in reply to FI

Hi,

The components have not yet been soldered to the PCB.

They still have their original NiPdAu plating

Here are some better pictures.

Slua271 is a very informative document but it only addresses the QFN solder reflow process.

Is there a specific percentage of die-attach voiding that is acceptable for these CC2652R1FRGZR components?

Thanks

0 Dorian Vazquez over 1 year ago in reply to Dorian Vazquez

Hello,

May I have an update on this?

Please let me know if you need additional information.

Thanks

0 FI over 1 year ago in reply to Dorian Vazquez

Hi,

The voids should not exceed 10% of the covered area.

Regards,

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