Solid ground plane vs. split ground plane, has always been a question which leads to endless discussions. Actually, I have read many documents, been through the pros and cons of each of the strategies, and still can not say that I have found the most reliable answer.
I am working on a TRF7970A NFC transceiver (which includes TRF7970A, MSP430, TPS61222, ...) and itself is a subsystem of a bigger module (consists of -at least - a GHz RF transceiver). Here is my question: In a 2-layer PCB design, should we have ground islands or follow the solid ground rules? In case the former idea would be more appropriate, does the ground island include the TRF7970A only, or the whole NFC transceiver subsystem?
Thanks alot, in advance!
Best Regards,
Politeknik