For the AM26LV31E & AM26LV32E with the QFN16 packing, is it OK to tie the thermal pad to ground? Didn't see any indication on the datasheets.
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Yes, the thermal pad is usually connected to the ground plane via an array of vias, as shown in the AM26LV32E data sheet on the land pattern for the RGY package.
I know it's hardly visible and difficult to find. But it is there.
I have also attached a short app-note on Power-pad soldering.
Regards, Thomas
The same recommendation applies for all RGY package devices? I am looking at the SN74AHC08RGYR. It is not explicitly clear in the datasheet that it should be connected to ground. It just states that it should be connected to a plane in the PCB.