AM26LV31E & AM26LV32E thermal pad to ground

Ignacio Linares

Other Parts Discussed in Thread: AM26LV32E, AM26LV31E

For the AM26LV31E & AM26LV32E with the QFN16 packing, is it OK to tie the thermal pad to ground? Didn't see any indication on the datasheets.

over 12 years ago

0 Thomas Kugelstadt over 12 years ago

TI__Mastermind 28265 points

Yes, the thermal pad is usually connected to the ground plane via an array of vias, as shown in the AM26LV32E data sheet on the land pattern for the RGY package.

I know it's hardly visible and difficult to find. But it is there.

I have also attached a short app-note on Power-pad soldering.

Regards, Thomas

slma004b.pdf

0 Adam Garrison1 over 9 years ago in reply to Thomas Kugelstadt

Intellectual 580 points

The same recommendation applies for all RGY package devices? I am looking at the SN74AHC08RGYR. It is not explicitly clear in the datasheet that it should be connected to ground. It just states that it should be connected to a plane in the PCB.

Interface

Interface forum

AM26LV31E & AM26LV32E thermal pad to ground