This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Part Number: ISOW7841
We are developing a board with the ISOW7841 that supplies two ADS124S08, and we are facing failure on radiated emission testing, as we can see below:
Our equipment has the following configuration / requirements:
There are 6 cables of 3m length connected to the ADCs; 3 cables on each ADC.
When we unplug all cables, the emissions fall below the limit.
Could you review our current design and provide some modifications to improve these results? We can share board schematic and layout on email.
Thanks for sharing this information and sorry to hear about the emissions issue.
Please do note that ISOW can only support a max current of 75mA when VCC = VISO = 3.3V. I see you have stated that your max current can be upto 100mA, we do not recommend drawing any more current than 75mA.
Thanks for testing ISOW for emissions without the cables and sharing the information. Yes, the cables along big PCB sizes do contribute to worsen overall system level emissions. Please do follow the recommendation of using CMC for power rails and FB/resistors for data lines as stated in the below E2E.
Implementing the above suggestions should definitely improve the emissions and enable you to meet your emissions requirements. Could you please confirm if your requirement is to meet CISPR 11 Class A or Class B?
I will reach out to you over email requesting for schematic and PCB layout for review. Thanks.
We are glad that we were able to resolve this issue, and will now proceed to close this thread.
If you have further questions related to this thread, you may click "Ask a related question" below. The newly created question will be automatically linked to this question.
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.