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uprating of electronic assemblies

steve wenner
Expert 2355 points
Other Parts Discussed in Thread: MSP430F5328, MSP430F249-EP, MSP430F2274-EP

Good afternoon.

I currently have a product design around an MSP430F5328 part and am migrating it to the new MSP432 product.  Through this migration I would like to operate at higher temperatures than 85C, recognizing that this is the maximum operating temperature of the part.  The first thing I would like to understand is what are the failure mechanisms associated specifically with this part that I can expect.  Can someone please advise me or share data with me regarding high temperature operation of MSP43x families?  

Thx

Steve

  • 0
    TI__Guru**** 207137 points

    Hello Steve,

    The most likely cause for failure at elevated temperatures is a shortened life span but there is no single cause that we can highlight. We do not provide any data on failure outside of the recommended temperature range but customers are always free to do internal self-testing to qualify at elevated temperatures, understanding that TI is not held responsible for device failure outside of specifications.

    Devices that are currently supported for 125C include the MSP430F2618-EP, MSP430F249-EP, and MSP430F2274-EP although it is understood that none of these are MSP432 devices. Possibilities to develop a 105 degree MSP432 have been discussed but nothing has been confirmed yet.

    Regards,
    Ryan

  • 0 in reply to Ryan Brown1
    Expert 2355 points

    Ryan.

    Thanks for the response.  I have a few follow on questions:

    1.  Can you tell me what makes your 85C parts different than say your 125C parts?  Is it all in batch testing or do you have to physically do things different on the die, etc. to meet these high temps?  

    2.  As I move forward in this process is there some up-rating standard that I should test against?

    Thx

    Steve

  • 0 in reply to steve wenner
    TI__Guru**** 207137 points
    Steve,

    1. I should have emphasized that each part originally mentioned have a normal (+85C) and EP (Enhanced Products, +125C) version. Collaboration is done with TI's HiRel team to produce EP products in which customized packaging accomplishes higher operating temperatures and extended product life cycles. Because of the extra cost to produce these parts most of our EP releases are customer driven.

    2. I'm sure there are some out there but I do not know much about them, that may be a question for the HiRel forum: e2e.ti.com/.../935

    Regards,
    Ryan
  • 0 in reply to Ryan Brown1
    Expert 2740 points

    Digikey.com lists more then 50 different ARM Cortex devices rated up to 125C

    Peter

  • 0 in reply to Peter Dvorak
    TI__Guru**** 207137 points
    And given maturity of the product line I'm sure that MSP432 will join in those ranks. Please remember that the MSP432 family of devices was only released earlier this year and although big plans are in store for this product it will take some time to see these plans realized.

    Ryan

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