Part Number: SN74AXC4T774-Q1 Tool/software: Hi,
The IBIS on the website has 0.7V, 1.8V and 3.3V models. We are wondering if you have the IBIS for 1.2V IO? If not, do you have another IC's IBIS that can be used to approximate the behavior of the 1.2V…
Part Number: SN74AXC4T774-Q1 Other Parts Discussed in Thread: SN74AXC4T774 , TXB0104 , TS3DS10224 , TXU0304-Q1 Tool/software: Hi team,
Customer is using SN74AXC4T774 - Q1 for SPI interface. Is there any limitation of the layout?
Please see below for 2 paths…
Part Number: SN74AXC4T774-Q1 Other Parts Discussed in Thread: TXV0106-Q1 Tool/software: Hi team,
My customer is using this device as 1.8V to 3.3V level shifter for TDM signal. It is sensitive for the propagation delay time. The delay time will have impact…
Part Number: SN74AXC4T774-Q1 Other Parts Discussed in Thread: TXV0106-Q1 , SN74AVC4T774-Q1 Tool/software: Though the datasheet claims speed of 310Mbps while converting 1.8V to 3.3 V signal, the measured data comes no where close to this. What could be…
Part Number: SN74AXC4T774-Q1 Tool/software: TI P/N SN74AXC4T774-Q1 has a pad option for package WQFN (P/N CAXC4T774QBQBRQ1).
Should I connect its thermal pad to GND, VCCA, VCCB or floating? I can not find this information in the datasheet.
Part Number: SN74AXC4T774-Q1 Tool/software: For the SN74AXC4T774-Q1 in the WQFN package there is a thermal pad as a part of the package. The data sheet does not mention this nor if it is tied to gnd. For this particular device should it be tied to ground…
Part Number: SN74AXC4T774-Q1 Other Parts Discussed in Thread: SN74LVC1G125
Hi,
SPI devices configured in the device as shown below. MISO line is output from Level shifter.
When SPI slave-2 driving MISO line, working as expected.
When SPI slave-2 driving…
Part Number: SN74AXC4T774-Q1 Hi team,
May I know how to evaluate the following parameter in our SN74AXC4T774-Q1 ?
1. IIH(?)
2. IIL(?)
3. Input Impedance(?)
4. Output Impedance:
4-1. (VCCB - VOH)/IOH = Output high impedance-> This value is consistent…
I found there are two different methods to calculate the maximum power dissipation for a device on E2E.
What is the different between these two methods?
Method 1:
Method 2:
Part Number: SN74AXC4T774-Q1 Hello,
Would you possible to provide the output impedance information for the SN74AXC4T774-Q1 at a few output frequencies? We are performing signal integrity and need the product output impedance information.
