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Hello TI team,
In our existing design we are using "LM324APWR" IC part.
Now, we want to replace "LM324APWR" by "LM324APWRG4" IC part.
Can you please support me to answer below queries,
1. What is the main difference in two parts?
2. Is there any difference in performance with respect to EMI/EMC point of view ?
3. Is there any difference in reliability with respect to environmental conditions ?
4. I have checked in datasheet there is only difference in lead finish, Can it will affect our soldering quality?
5. What are the changes to be done in PCB assembly process with respect to both parts soldering ?
Thanks and Regards,
Ramdas Tibile
There is no difference; see [FAQ] Why does a logic device's part number have an E4/G4 suffix?
The LM324APWR is made at two manufacturing sites; one uses NiPdAu lead finish, the other uses Sn. Some of the devices made at the first site are also sold as LM324APWRG4.
Hello,
Thanks for your valuable feedback.
1. Is there any soldering quality difference in NiPdAu lead finish and sn?
2. Is there any need of soldering profile change during manufacturing, if we replace these parts (E4 to G4)?
1. For details, see Board-Mount Evaluation of Tin-Plated Component Leads; its conclusion is:
The Sn-finished leads will perform well with both Pb-bearing and Pb-free solder pastes. Their solder wetting performance is equivalent to the other Pb-free finish that TI uses, NiPdAu.
2. No. E4 and G4 are identical.