LM324: LM324APWR poor soldering

Hi Rock,

Please confirm that the product is purchased from TI authorized distributor. 

In addition, please make sure that the soldering paste is compatible with the lead frame materials. This seems to be wetting issues during the soldering process. 

Please follow the guideline list in the following document. I do not have experience in the reflow process, but the peak temperature seems to be a lower than the document prescribed. Please check on the temperature peak profile. 

https://www.ti.com/lit/an/spraby1a/spraby1a.pdf

The issues are likely related to ICs' storage condition, lead frame's surface oxidation or contamination etc..  The following links are lead frame material surface composition, but I am unable to tell what product you purchased (there are two different lead finish coatings. 

https://www.ti.com/materialcontent/en/search?partType=tiPartNumber&partNumber=LM324APWR

This may be product quality related issues. E2E is a technical support forum for our product. I would suggest to contact TI distributors and return the product, if the soldering process is not the issue. 

https://www.ti.com/support-quality/additional-information/customer-returns.html

Best,

Raymond

Hi Raymond,

There are some questions need the check:

1. What are the acceptable peak temperature conditions for TI's products, such as the minimum time required to set the manufacturing conditions to 260 degrees? What is the longest acceptable time?

2. When did the Rough Leadframe Surface process change occur? 

3. Are there any other customers’ diagrams for the Reflow Profile that we can refer to?

Thanks and regards,

Hi Rock, 

I do not do manufacturing support for the soldering process, and I need to ask a production expert and get it back to you. 

If I look at the other soldering wetting issues, your reflow temperature may be on a low side. Normally, you can increase the time or increase the peak temperature slightly or increase time/peak temperature on both. This is a typical fine tuning and optimization process, since every temperature chamber is slightly different (even different location in the chamber has temperature variations). So you will need to increase the average temperature and/or time to have enough energy to flow the soldering material - to have the alloy to flow or wet better during the soldering process  

Best,

Raymond

Hi Rock, 

I have contacted our process engineers. Please provide the following information, if the soldering issues have not resolved. 

Best,

Raymond