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Hi TIer
When I recommend the customer to use OPA2810 replace AD8066. customer concern the cooling capacity of OPA2810.
Customer prefer the chip with thermal pad.
So could you provide me with a more suitable replacement material with thermal pad?
Thank you very much!
Hi Yuxi,
The AD8066 isn't offered in a package with thermal pad either. Is there a concern with the cooling capacity of the OPA2810 vs AD8066?
We have other devices like the OPA2863A which are offered in a package with thermal pad (3x3mm DSN-10 with thermal pad). Please share the key specifications required for this application and why is there a need for the thermal pad so we can run a comprehensive search and suggest the best available options.
Regards,
Bharat Agrawal
yes , AD8066 is not offered thermal pad. Customer need good cooling capacity, they do not test OPA2810.
how to filter the chip which offer thermal pad on ti.com?
I do not find this filter setting.
Hi Yuxi,
There is no direct way to filter out devices with a power pad using the parametric search table. We need to either search by package (if a certain package is known to have a power pad) or go through the datasheets to find this out.
For this requirement, I see the THS4032DGN and OPA2863ADSN as two potential options:
1. The THS4032DGN is a 220 MHz. GBW, low-noise, 32 V voltage feedback amplifier.
2. The OPA2863ADSN is a 50 MHz, RRIO, low-power, voltage feedback amplifier with very high precision of max. 1.2 uV/C offset drift and max. 95 uV offset.
Would any of these devices meet the customer's requirements?
Regards,
Bharat Agrawal