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INA851: Thermal Pad to Ground not VS-

Christopher Eric Cobbs
Prodigy 20 points
Part Number: INA851

Is there an issue with connecting the Thermal Pad of the INA851 to ground rather than VS-? The datasheet says to connect to the most negative rail VS- but doesn't give any reasoning why. I'd like to know if there will be any function problems with the device as we've made this mistake. If this is an issue would there be any problem with just floating the pad or must it be referenced to some voltage?

Thanks!

  • 0
    TI__Guru 55466 points

    Hi Chris,

    The thermal pad must be connected to the most negative supply Vs-.  The thermal pad  must be connected to the most negative supply and not other potential.  Almost all modern semiconductor products use p-substrate process to implement the transistor-level circuitry, which require the p-substrate to be biased at the most negative supply voltage used to power the IC. Thus, connecting the thermal pad (located at the back-side of the silicon wafer) to any voltage above (V-) may result in current leakage that increases at the elevated temperature – see below.

    Thank you and Regards,

    Luis