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Dear Technical Support: Good day,
We plan to use several of your Microcontroller IC devices, Please see attached EXCEL file, We hope to know the following information regarding the fabrication of related ICs, Specifically, the technology nodes used for fabrication of these ICs used in our products,
Can you please provide these related information listed in the attached EXCEL file at your earliest convenient, Thanks. yenwu lo
The_technology_nodes_used_for_fabrication_of_the_ICs_made_by_Texas_Instruments_1.xlsx
Hello Yenwu,
We can only speak for the Amps and Comparators. The Power and Logic devices should be posted to the approprite forums.
For the LM211 and LM193, they are fab'ed on a high voltage junction Isolated bipolar process. Feature size is proprietary information, but we wold say >= 350nm.
The LM211 and LM139 die are fab'ed in the US.
For the LM193, the assembly is in Taiwan.
For the LM211's, assembly is in Mexico.
For the OPA2277, the die is fab'ed in Germany on a BiCMOS process, and assembled in Malaysia.
Correction, the OPA4277 is a BICMOS process (both CMOS and Bipolar).
Corrected above.
Thank you , Paul,
please help to close this case for now. No question at this time.
Thanks. Paul, so I see, OPA2277 has same size as the LM211 device, No more questions on this at this time.