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OPA627：OPA627AU

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Prodigy 10 points
Part Number: OPA627

Tool/software:

When exactly did the OPA627AU model start production?
  • 0
    TI__Guru 53546 points

    The OPA627 device was originally introduced to the market on 1989 on plastic DIP and metal can packages.

    The SOIC package was introduced around the mid 1990's, it shows on the Burr-Brown IC Data book from 1995.  

    Thank you and Regards,

    Luis