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Tool/software:
Hi. Prototyping with a BGA with 0.4mm spacing can be a challenge. Why wouldn't TI offer a QFN (or equiv) package for this part? It's a really great part but a challenge to test/debug. In particular, it appears as though I have a short between my I2C lines.
Kind of a rhetorical question I guess but I never understood why manufacturers don't offer alternative packaging for super tiny BGA parts. I've seen this with other companies.
Thanks,
Kevin
I'd guess the first (large) customers want to use it in mobile devices.
For prototyping, you can use the INA423XEVM.
Thanks. I have an EVM but I need 3 4235's on my board so it would still be nice if manufacturers would make a slightly easier prototyping package available. Not only that but the BGA has 0.4mm spacing requiring the 4 center balls to encapsulate vias into their pads. This adds significant cost to the PCB manufacturing and could easily be averted if a QFN package were available.
Just some thoughts if any TI marketing or design engineers happen to come across this...
Hey Kevin,
Thank you for your suggestion. As Clemens mentioned, right now the only option would be to use the EVM or make your own setup. I am not sure, but it's possible that there are some sockets available as well. I will pass on your comments on to the team that makes these decisions.
Regards,
Mitch
Thanks Mitch. Yeah, I've seen this with other semiC manufacturers as well. I think it's just a matter of the design engineers really not experientially understanding the full prototype scenario especially for smaller companies.
Thanks for passing it along!
It looks like they are offering to offer the INA4235/INA4230 in a qfn-16 package on an unknown timeline.
https://e2e.ti.com/support/amplifiers-group/amplifiers/f/amplifiers-forum/1422568/ina4230-rail-monitor-future-availability-in-qfn/5451501#5451501
I could probably handle a 0.5mm pitch bga, but 0.4mm is forcing an increase to our board technology on a design that barely needs uvias in the first place. All other bgas are 0.8mm pitch or larger.
Hey Marshall/Kevin,
Yes, this is planned for the future, but we do not have a timeline at this point.
Regards,
Mitch
That's wonderful! Thanks Mitch/Marshall!
In the meantime, I've designed a breakout board (actually 80 of them) with the INA4235 BGA on the top and the pins in four 4-pin SiP's in a ~10mm^2 footprint for easy test/debug. I've even included test points for each pin and an onboard bypass cap. They should be arriving in a week or so. I'l letcha know how well they work out. Should anyone need some, let me know: bard-designs. com.
Thanks, Kevin