Other Parts Discussed in Thread: INA423XEVM,
Tool/software:
Hi. Prototyping with a BGA with 0.4mm spacing can be a challenge. Why wouldn't TI offer a QFN (or equiv) package for this part? It's a really great part but a challenge to test/debug. In particular, it appears as though I have a short between my I2C lines.
Kind of a rhetorical question I guess but I never understood why manufacturers don't offer alternative packaging for super tiny BGA parts. I've seen this with other companies.
Thanks,
Kevin