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Tool/software:
Need package drawing and recommended land pattern details for this part number "OPA2211AIDDA". since the datasheet does not contains those information, please share.
HI Madheshwari,
Let me search for this information, as the information on the product landing page only shows the generic package information, but does not show the land pattern details.
Thank you and Best Regards,
Luis
Hi Madheshwari,
Attached below is the package drawing from the previous OPA2211 data sheet revision for the OPA2211AIDDA SOIC-8 package, with the exposed thermal pad.
Although we believe the package drawing is up-to-date, I am still working to verify with the product engineer and packaging team that there have been no changes, since the data sheet and the product website page are not currently showing the package drawing information. This may take a few days.
Thank you and Kind Regards,
Luis
HI Madheshwari,
Yes, this is the right package drawing, there has not been any package changes, matching the previous data sheet revision. The package attached in the previous post should show on the OPA2211 data sheet and product landing page soon. I have submitted a ticket to resolve this, but this process may take a few days to update on the web.
Thank you and Regards,
Luis