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TLC393: Thermal paramater

Part Number: TLC393
Other Parts Discussed in Thread: TLV1822, LM358LV

Tool/software:

Hello,

We would like to know the specification of Ψjt, θja and θjc of TLC393IPWR packege.

 

Regards,

Mochizuki

  • Hello Mochizuki-san,

    These values have not been measured or simulated. Now that a the TLC393 is of a sub status of "A newer version of this product is available that is Drop-in replacement with upgraded functionality to the compared device", no further changes of data sheet other than error correction is expected. I

    That replacement device TLV1822 data sheet does have the specifications that you requested. 

  • Hello Ron,

    Thank you very much for your prompt reply.

    We will introduce TLV1822 to replace TLC393 in the future project.

    This time they look for PW package thermal data, but there is not that type of package.

    So, instead of this can we use LM358LV PW(TSSOP)8pin thermal data as similarity?

    Regards,

    Mochizuki

  • Mochizuki,

    can we use LM358LV PW(TSSOP)8pin thermal data as similarity?

    This could be used as a approximation.  

    Note that θjc for all chips is only useful when used with a heat sink. Without a heat sink little heat flows that way. That's why Ψjt is useful parameter