Tool/software:
Hello,
As we are upgrading our design looking into wafer from FR4. Already we have done the testing at FR4 board with package part components. Below part numbers are we using in our design.
1) SN74LVC2G126YZPR
2) TLV75533PDRVR
3) TPS92201AMDRVR
4) TMUX1101DCKR
5) REF35102QDBVR
6) OPA330AIDCKT
In the wafer design our target thickness of the component is maximum 0.35MM. So, we are planning to go with Bare-Die package. As of now the die package datasheet is not available.
Could you please share above the parts Bare-Die package datasheet for further design activity.
We would appreciate your response as soon as possible.
