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LMV324: PCN changes / Markings

Christoph Thurnheer
Prodigy 30 points
Part Number: LMV324
Other Parts Discussed in Thread: LM324LV

Tool/software:

Hi

There was a PCN for LMV324IDR (PCN# 20230128000.1) describing several changes, especially the switch to 300 mm wafers. The PCN also states that no impact on form, fit, function, quality or reliability (positive/negative) is expected. We are also aware that some devices have been standardized in terms of marking (PCN # 20211123004.0).

I have looked through the two data sheets and found no discrepancies in the data sheets for the electrical characteristics. Can you confirm this? 

The question arose because we noticed a difference of around 40mV in the output swing, low level in our design. Hence the question of which of the following devices were manufactured according to which process (LBC9 or BCB).

Thank you.

  • 0
    Guru 298710 points

    The guaranteed limits have not changed. Typical characteristics can change.

    What is the voltage that you have measured at which output current?

  • 0 in reply to Clemens Ladisch
    Prodigy 30 points

    The ‘old’ components had an output voltage of about 40mV over the years. After the change we measure about 5mV. This is with a sink current of 20uA.

  • 0
    TI__Guru**** 157366 points

    Christoph,

    VOL (output voltage low) was around 40mV unloaded (BCB) and now it is just above 0mV (LBC9); then yes that is real. The PCN includes design and wafer process. The VOL design was NPN collector with anti saturation and now it NMOS drain. There is no data sheet limit preventing it from being better. 

  • +1 in reply to Christoph Thurnheer
    Guru 298710 points

    I suspect that the new die is identical with the LMV324A or LM324LV (both CMOS devices); see those datasheets for typical values.