LM7301: PCN behind these marking change and DIE structure changes

As shown on ti.com/material-attributes-search/?material=LM7301IM5X/NOPB, this device is made at five assembly locations, so it is possible to get five different leadframes or markings even without a PCN.

Hi Manoj,

manoj balakrishnan said:

Can you please check and advise PCN behind these changes  ? 

I think that this is PCN related to these changes. 

https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/5858/PCN_20240203000.0.pdf

As Clemens indicated, different TI manufacturing sites may use different leadframes, but the Si-die for the same part number is the same. 

If you have additional questions, please let me know. 

Best,

Raymond 

Hello Manoj,

Yes, the difference in the die markings are due to a change in assembly site. Here is the link to the relevant PCN indicating an additional assembly site for this die.

Please let me know if you have further questions.

Best,

Carrie

Hello Carrie , 

Thank you so much for your support. 

Regards 

Manoj