LM7301: PCN behind these marking change and DIE structure changes

manoj balakrishnan

Intellectual 395 points

Part Number: LM7301

Tool/software:

Hello Experts ,

Please find below differences in the markings and X-Ray DIE structure of the part.

Can you please check and advise PCN behind these changes ?

Thank you..

Regards

Manoj

6 days ago

0 Clemens Ladisch 6 days ago

Guru 298340 points

As shown on ti.com/material-attributes-search/?material=LM7301IM5X/NOPB, this device is made at five assembly locations, so it is possible to get five different leadframes or markings even without a PCN.

0 Raymond Zhang1 5 days ago

TI__Guru 62821 points

Hi Manoj,

manoj balakrishnan said:
Can you please check and advise PCN behind these changes ?

I think that this is PCN related to these changes.

https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/5858/PCN_20240203000.0.pdf

As Clemens indicated, different TI manufacturing sites may use different leadframes, but the Si-die for the same part number is the same.

If you have additional questions, please let me know.

Best,

Raymond

0 manoj balakrishnan 1 day ago in reply to Raymond Zhang1

Intellectual 395 points

Hello Raymond ,

Thank you so much for your response.

Refer to below images belongs to same marking change and lead frame changes.

Can you please check and confirm it ?

Also send me the PCN for the additional assembly included in the List for this MPN.

Please advise.

Regards

Manoj Balakrishnan.

0 Carrie Stoll 22 hours ago in reply to manoj balakrishnan

TI__Prodigy 20 points

Hello Manoj,

Yes, the difference in the die markings are due to a change in assembly site. Here is the link to the relevant PCN indicating an additional assembly site for this die.

Please let me know if you have further questions.

Best,

Carrie

0 manoj balakrishnan 19 hours ago in reply to Carrie Stoll

Intellectual 395 points

Hello Carrie ,

Thank you so much for your support.

Regards

Manoj

Amplifiers

Amplifiers forum

LM7301: PCN behind these marking change and DIE structure changes