Part Number: OPA551
The schematic is attached
This design is a interface between a HIL device and our BMS PCBA. It suppose to amplify HIL outout of ~3V by the gains designed in each CT amplifier circuit.
We noticed a relative warm tempurature(55~60 degree C) when the board is running idle(means only a 55V power supplay is connected).
The question we have is that, is this design feasible for our purpose? When we connect BMS to this section, it draws over 50W of power and over heat very quickly.