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OPA344: Junction to case parameter confirm

Wenhsiang Lin
Intellectual 520 points
Part Number: OPA344
Other Parts Discussed in Thread: TLV9101, , TLV376

Hi Team:

Please help to provide Junction to case parameter of OPA344NA  for RD request , thanks.

Regards / Mark

  • 0
    Guru 140200 points

    Hi Wenhsiang,

    for the SOT-23 package much of the heat is dissipated via the terminals to the solder points and to the PCB. So, usually the junction to ambient thermal resistance is given in the datasheet.

    Kai

  • Former Member
    0 Former Member

    Hello Mark,

    I am working on getting a request for this information submitted.  I will reach out again once I have an update.

    Regards,

    Daniel

  • Former Member
    0 Former Member in reply to Former Member

    Mark,

    I have submitted the required information for this request and am waiting for the results of the request.  This typically takes 2 days to complete.

    I will reach out to you once I have the results or within 48 hours, whichever occurs first.

    Regards,

    Daniel

  • 0 in reply to Former Member
    Intellectual 520 points

    Hi Daniel:

    Thanks for support , I will inform customer and after get it will feedback soon.

    Regards / Mark

  • Former Member
    0 Former Member in reply to Wenhsiang Lin

    Hello Mark,

    I was expecting to hear back on my thermal data request by now, but have not.  I will look into it again tomorrow and come back with an update.

    Thank you for your patience.

    Regards,

    Daniel

  • 0 in reply to Former Member
    Intellectual 520 points

    Hi Daniel:

    Waiting for your good news , thanks a lot.

    Regards / Mark

  • Former Member
    0 Former Member in reply to Wenhsiang Lin

    Hello Mark,

    Unfortunately, there seems to have been an issue with my request and it looks like I am going to have to submit a new one.  I am not sure what occurred, but will ensure it does not happen again.

    I sincerely apologize for the delay and thank you for your patience.  I will try to see that the new request gets handled ASAP.

    Regards,

    Daniel

  • Former Member
    0 Former Member in reply to Former Member

    Mark,

    I have re-submitted your request and expect to hear back next week.

    Thank you for your patience.

    Regards,

    Daniel

  • 0 in reply to Former Member
    Intellectual 520 points

    Hi Daniel:

    Need your help to push and speed up process it  because of we are creating customer's P/N than get order , thanks a lot.

    Regards / Mark 

  • Former Member
    0 Former Member in reply to Wenhsiang Lin

    Hello Mark,

    I have personally reached out to the individual pulling the information and have been told that this information will be available by the end of the week.

    Regards,

    Daniel

  • Former Member
    0 Former Member in reply to Wenhsiang Lin

    Hello Mark,

    Again, thank you for your patience.

    Below you will find the results of your inquiry.  Please let me know if I can be of further assistance.

    Regards,

    Daniel

  • 0 in reply to Former Member
    Intellectual 520 points

    Hi Daniel:

    As customer request , please help to confirm , could this parameter table update to datasheet ?

    If not , could TI provide guarantee letter ? contact window ? 

    Regards / Mark

  • Former Member
    0 Former Member in reply to Wenhsiang Lin

    Hi Mark,

    This type of a request requires work and approval from someone besides myself.

    I've asked about this and will get back to you as soon as I hear back, ideally tomorrow.

    Regards,

    Daniel

  • Former Member
    0 Former Member in reply to Former Member

    Hello Mark,

    Thanks for your patience. Here's what I've gathered:

    It's important to note that thermal performance is not assured like specifications in the electrical characteristics table that are tested at final test. The same holds true for a letter. Thermal metrics in semiconductor data sheets are given under very particular conditions. For example, there are particular PCBs used as outlined by JEDEC (e.g. low-K 1s, high-K 2s2p) that are used to obtain these values. It is extremely unlikely that the JEDEC PCBs and the application PCBs are exactly the same. Therefore these values are best used as a relative measure of thermal performance. Here are a couple application notes that have additional information. Section 1 of the first reference may be of particular interest.

    www.ti.com/.../spra953c.pdf

    www.ti.com/.../szza017a.pdf

    That said, while it is possible to update the data sheet with the desired information, the fastest and most efficient way to meet this requirement is to look for a newer device that has the desired information already in the data sheet.

    So, there are a couple devices that I recommend for evaluation. First, the TLV376 is a production device that compares well with the OPA344, but it does have higher bandwidth (5.5MHz). If this is not an issue, I would check this device first. Secondly, the TLV9101 is also potentially a good replacement, however that device has a slightly higher max offset voltage (1.6mV) than the OPA344. I should also note that the TLV9101 is currently in preview, but when the data sheet is finalized it will have all of the desired thermal information. Finally, the TLV9101 is more cost competitive than the other devices.

    I hope this helps.

    Regards,

    Daniel