OPA551: PCB thermal resistance

May

Part Number: OPA551
Other Parts Discussed in Thread: OPA552

Hi Team,

Customer looking for PCB thermal resistance calculator for this device. Below is the inquiry.

"Your thermal analysis tool does not seem to provide this part number for determining the PCB thermal resistance. Does TI have a thermal analysis tool that can help select the copper area and thermal vias for this D2PAK?

I've checked the https://www.ti.com/design-resources/design-tools-simulation/models-simulators/pcb-thermal-calculator.html but there is no details for OPA551.

Regards,

Maynard

over 5 years ago

0 Thomas Kuehl over 5 years ago

TI__Guru* 93105 points

Hi Maynard,

I checked that thermal calculator and it doesn't appear to have been applied universally across all TI devices. Every different device I tried produced the same curve.

The OPA551 has been around a few decades and its datasheet provides the most relevant thermal information. Section 10.5 provides Heat Sinking information for the OPA551/OPA552 states:

"For heatsinking purposes, the tab of the DDPAK/TO-263 is typically soldered directly to the PCB copper area. Increasing the copper area improves heat dissipation. Figure 38 shows typical thermal resistance from junction-to-ambient as a function of copper area."

Some modern PC board layout programs such as Altium include design capabilities for thermal design. See for example what Altium provides:

https://www.altium.com/solution/thermal-pads

Altium is the PC board program used throughout TI so you should have access to it.

Regards, Thomas

Precision Amplifiers Applications Engineering

0 May over 5 years ago in reply to Thomas Kuehl

TI__Genius 9880 points

Hi Thomas,

Thank you for your kind response.

Customer want to know if there is a chance that D2PAK could be added to the TI online thermal calculator?

Regards,

Maynard

0 Thomas Kuehl over 5 years ago in reply to May

TI__Guru* 93105 points

Hi Maynard,

The thermal calculator was developed by another TI organization without any involvement with our Precision Amplifiers group. It appears to have been developed primarily for use with TPS products. We have no knowledge of who did the original work other than possibly the people who wrote the Applications Report back in 2010:

https://www.ti.com/lit/an/slua566a/slua566a.pdf

I searched the e2e forums and the closest applicable support group looks like it may be the Simulation, hardware & system design tools forum

I opened a thread on that forum asking about the status of the thermal tool and if any additional products could be added to it at this point? You can find my post here:

https://e2e.ti.com/support/tools/sim-hw-system-design/f/simulation-hardware-system-design-tools-forum/991641/can-additional-products-be-added-to-the-pcb-thermal-calculator

We'll have to wait and see their response.

Thomas

Precision Amplifiers Applications Engineering

Amplifiers

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OPA551: PCB thermal resistance