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Original question:

OPA551: PCB thermal resistance

OPA551: OPA551

Joseph Borrelli
Prodigy 30 points

Part Number: OPA551
Other Parts Discussed in Thread: OPA552

TI Customer Support,

You answer to this question referred me to Altium Designer.  I do not have access to Altium designer at Triumph.  I was expecting a graph of the D2PAK vs copper area like your website provides for other packages.

Regards,

Joe Borrelli

  • 0
    TI__Guru* 93105 points

    Hi Joe,

    Please see datasheet Figure 39, "OPA551, OPA552 Surface-Mount Package Circuit Board Copper Area." It is a graph of Thermal Resistance, θJA (°C/W) vs Copper Area (sq-inches). It is for a PB board having 1 oz copper on the surface to be used for heat dissipation.

    The text in datasheet Section 10.5 refers to the graph and states "For heatsinking purposes, the tab of the DDPAK/TO-263 is typically soldered directly to the PCB copper area. Increasing the copper area improves heat dissipation. Figure 38 shows typical thermal resistance from junction-to-ambient as a function of copper area." Use this information to determine how much PC board copper area must be provided to dissipate the heat generated under your particular operating conditions.

    The graph is the extent of the information we have for the OPA551/OPA552 DDPAK PB board thermal design. 

    Regards, Thomas

    Precision Amplifiers Applications Engineering