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TAS5825M: Co-layout TAS5825 with TAS5766M

Dave Chang
Expert 3315 points
Part Number: TAS5825M
Other Parts Discussed in Thread: TAS5766M

Dear Audio support team,

This is FAE Dave located in Taiwan.

Due to the supply issue, our customer wants to co-layout TAS5825 with TAS5766M(VQFN package).

Since they have the limited space for the design, I want to make sure that what are critical to co-lay these two ICs to explain to customer.

Thanks again for the support!

Dave

  • 0
    TI__Mastermind 34480 points

    Hi Dave

        There's no special rules for co-layout, they should take care of the layout rules for both devices, including the thermal, current loop, decoupling capacitors, and so on. You can offer some advice like follows:    

    • The PowerPAD needs to be soldered to the PCB and adequate copper area and copper vias connecting the top, bottom and internal layers must be used.
    • Decoupling capacitors: the high-frequency decoupling capacitors must be placed as close to the supply pins as possible; 
    • Keep the current loop from each of the outputs through the output inductor and the small filter cap and back to GND as small and tight as possible. The size of this current loop determines its effectiveness as an antenna.
    • Grounding: A big common GND plane is recommended. The PVDD decoupling capacitors must connect to GND.
    • Output filter: remember to select inductors that can handle the high short circuit current of the device. The LC filter must be placed close to the outputs.
    • Avoid placing other heat-producing components or structures near the amplifier (including above or below in the end equipment).
    • Use a higher layer count PCB if possible to provide more heat sinking capability for the device and to prevent traces of copper signal and power planes from breaking up the contiguous copper on the top and bottom layer.
    • Place the device away from the edge of the PCB when possible to ensure that heat can travel away from the device on all four sides.
    • Avoid cutting off the flow of heat from the device to the surrounding areas with traces or via strings. Instead, route traces perpendicular to the device and line up vias in columns which are perpendicular to the device.